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DDL-CFP- IET Smart Grid Special Issue on Resilience

June 15

IET Smart Grid is inviting submissions for a Special Issue on “Definition, Quantification, Analysis and Enhancement of Grid Resilience.”

https://digital-library.theiet.org/files/IET_STG_DQAEGR.pdf

Topics of interest include, but are not limited to:
* Framework for defining grid resilience and developing resilience metrics
* Methods for quantification and analysis of grid resilience
* Modeling and analysis of the impacts of extreme events on power grids
* Awareness of situation in power systems after extreme events
* Modeling, simulation and analysis of interdependency among critical infrastructures
* System design and planning considering resilience
* Preparedness and mitigation measures for resilience enhancement
* Using microgrids and networked microgrids to improve grid resilience
* Fast restoration and recovery of power grids after extreme events
* Management of interdependency among critical infrastructures for resilience enhancement
* Artificial intelligence (AI) and machine learning techniques for resilience evaluation and enhancement
* The application of internet of things (IoT) for resilience of power systems

Submit your paper to our manuscript submission and peer review site via the following link: www.ietdl.org/IET-STG

Proposed publication schedule:
* Submission Deadline: 15th June 2019
* Publication Date: December 2019

Lead Guest Editor:
Yin Xu, Beijing Jiaotong University, China   Email: xuyin@bjtu.edu.cn

Guest Editors (in alphabetical order):
Prabodh Bajpai, Indian Institute of Technology Kharagpur, India   Email: pbajpai@ee.iitkgp.ernet.in
Zhaohong Bie, Xi’an Jiaotong University, China   Email: zhbie@mail.xjtu.edu.cn
Ying Chen, Tsinghua University, China   Email: chen_ying@mail.tsinghua.edu.cn
Yunhe Hou, University of Hong Kong, Hong Kong   Email: yhhou@eee.hku.hk
Andrew Keane, University College Dublin, Ireland   Email: andrew.keane@ucd.ie
Chen-Ching Liu, Virginia Tech, USA   Email: ccliu@vt.edu
Thomas Overbye, Texas A&M University, USA   Email: overbye@tamu.edu
Mohammad Shahidehpour, Illinois Institute of Technology, USA   Email: ms@iit.edu
Dipti Srinivasan, National University of Singapore, Singapore   Email: dipti@nus.edu.sg
Anurag Srivastava, Washington State University, USA   Email: asrivast@eecs.wsu.edu

Details

Date:
June 15